Until the via filling of conductive paste! Solder paste printer TD-4420
High precision design with a printing accuracy of ±10μm enables narrow and narrow-pitch printing! By realizing 'hybrid squeegeeing,' we challenge the limits of screen printing.
The product "Solder Paste Printer TD-4420" is a printing machine that uses a paste press-in method and is equipped with a housing-type squeegee unit. (Examples of Use) - Formation of solder bumps on flip chip interposer substrates (bump pitch 150–200μm) - Formation of solder bumps on 6/8-inch wafers for printed devices (bump pitch 120–150μm) - Formation of solder bumps on 4-inch wafers for wireless communication devices (bump pitch 150–170μm) (Features of the Squeegee Unit) - The paste is stored in a cartridge with a structure that is shielded from the outside air, which helps prevent degradation such as oxidation. - The rotation pressure of the roller shaft inside the cartridge ensures that the paste is reliably filled into the mask opening. - The automatic replenishment and automatic stirring functions maintain a consistent amount and viscosity of the paste within the cartridge. - This printing method does not leave paste on the mask after squeegeeing, which can reduce paste loss. *For more details, please refer to the PDF document. Evaluation demos in a clean room (Class 10,000) are also possible. Please feel free to contact us.
- Company：谷電機工業
- Price：Other
